ASROCK H110M-DVS/D3 Manual de usuario

Tipo
Manual de usuario
Version 1.0
Published July 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate
ASRock Website: http://www.asrock.com
1
English
H110M-DVS/D3
Intel
H110
DDR3_B1 (64 bit, 240-pin module)
DDR3_A1 (64 bit, 240-pin module)
CMOS
Battery
Super
I/O
ATXPWR1
Top:
RJ-45
USB 2.0
T: USB0
B: USB1
CLRCMOS1
1
HDLED RESET
PLED PWRBTN
PANEL1
1
USB4_5
COM1
1
1
HD_AUDIO1
H110M-DVS/D3
CHA_FAN1
RoHS
7
9
12
16
15
2
CPU_FAN1
3
4
6
5
1
128Mb
BIOS
Audio
CODEC
PCIE1
PCI Express 3.0
TPMS1
1
1
USB3_4_5
PCIE3
USB 2.0
T: USB2
B: USB3
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
1
ATX 12V1
USB 3.0
T: USB0
B: USB1
PS2
Keyboard
/Mouse
SPK_CI1
1
PCIE2
Front USB 3.0
8
10
11
13
14
17
VGA1
DVI1
SATA3 _0 S ATA3_2
SATA3 _1 S ATA3_3
Motherboard Layout
2
English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
4 ATX Power Connector (ATXPWR1)
5 USB 3.0 Header (USB3_4_5)
6 SATA3 Connector (SATA3_2)
7 SATA3 Connector (SATA3_3)
8 SATA3 Connector (SATA3_1)
9 SATA3 Connector (SATA3_0)
10 Clear CMOS Jumper (CLRMOS1)
11 System Panel Header (PANEL1)
12 USB 2.0 Header (USB4_5)
13 Chassis Intrusion and Speaker Header (SPK_CI1)
14 TPM Header (TPMS1)
15 COM Port Header (COM1)
16 Chassis Fan Connector (CHA_FAN1)
17 Front Panel Audio Header (HD_AUDIO1)
3
English
H110M-DVS/D3
I/O Panel
No. Description No. Description
1 PS/2 Mouse/Keyboard Port 6 Microphone (Pink)**
2 D-Sub Port (VGA1) 7 USB 2.0 Ports (USB01)
3 LAN RJ-45 Port* 8 USB 2.0 Ports (USB_23)
4 Line In (Light Blue)** 9 DVI-D Port
5 Front Speaker (Lime)** 10 USB 3.0 Ports (USB3_01)
6
7
8
9
3
5
4
10
1
2
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Port
4
English
** To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-
channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
5
English
H110M-DVS/D3
1 Introduction
ank you for purchasing ASRock H110M-DVS/D3 motherboard, a reliable
motherboard produced under ASRocks consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRocks
commitment to quality and endurance.
1.1 Package Contents
• ASRock H110M-DVS/D3 Motherboard (Micro ATX Form Factor)
• ASRock H110M-DVS/D3 Quick Installation Guide
• ASRock H110M-DVS/D3 Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modi-
cations of this documentation occur, the updated version will be available on ASRock’s
website without further notice. If you require technical support related to this mother-
board, please visit our website for specic information about the model you are using. You
may nd the latest VGA cards and CPU support list on ASRock’s website as well. ASRock
website http://www.asrock.com.
6
English
1.2 Specications
Platform
• Micro ATX Form Factor
• Solid Capacitor design
• High Density Glass Fabric PCB
CPU
• Supports 6
th
Generation Intel® Core
TM
i7/i5/i3/Pentiu/
Celeron® Processors (Socket 1151)
• Supports Intel® Turbo Boost 2.0 Technology
Chipset
• Intel® H110
Memory
• Dual Channel DDR3/DDR3L Memory Technology
• 2 x DDR3/DDR3L DIMM Slots
• Supports DDR3/DDR3L 1600/1333/1066 non-ECC, un-
buered memory
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
Expansion
Slot
• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
• 2 x PCI Express 2.0 x1 Slots
Graphics
* Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
• Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. shared memory 1792MB
• Dual graphics output: Support DVI-D and D-Sub ports by
independent display controllers
• Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
• Supports D-Sub with max. resolution up to 1920x1200 @
60Hz
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English
H110M-DVS/D3
• Supports Accelerated Media Codecs: HEVC, VP8, VP9
• Supports HDCP with DVI-D Port
• Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
Port
Audio
• 7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
• Supports Surge Protection (ASRock Full Spike Protection)
• ELNA Audio Caps
LAN
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111E
• Supports Wake-On-LAN
• Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
• Supports LAN Cable Detection
• Supports Energy Ecient Ethernet 802.3az
• Supports PXE
Rear Panel
I/O
• 1 x PS/2 Mouse/Keyboard Port
• 1 x D-Sub Port
• 1 x DVI-D Port
• 4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
• 2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
• HD Audio Jacks: Line in / Front Speaker / Microphone
Storage
• 4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
8
English
Connector
• 1 x COM Port Header
• 1 x TPM Header
• 1 x Chassis Intrusion and Speaker Header
• 1 x CPU Fan Connector (4-pin) (Smart Fan Speed Control)
• 1 x Chassis Fan Connector (4-pin) (Smart Fan Speed Con-
trol)
• 1 x 24 pin ATX Power Connector
• 1 x 4 pin 12V Power Connector
• 1 x Front Panel Audio Connector
• 1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
• 1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
BIOS
Feature
• 128Mb AMI UEFI Legal BIOS with multilingual GUI sup-
port
• ACPI 1.1 Compliant wake up events
• SMBIOS 2.3.1 Support
• CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA Voltage
Multi-adjustment
Hardware
Monitor
• CPU/Chassis temperature sensing
• CPU/Chassis Fan Tachometer
• CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
• CPU/Chassis Fan multi-speed control
• CASE OPEN detection
• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, CPU
OS
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 62 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRocks
website for details: http://www.asrock.com
9
English
H110M-DVS/D3
Please realize that there is a certain risk involved with overclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technology, or using third-party
overclocking tools. Overclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your own risk and expense.
We are not responsible for possible damage caused by overclocking.
* For detailed product information, please visit our website:
http://www.asrock.com
Certica-
tions
• FCC, CE, WHQL
• ErP/EuP ready (ErP/EuP ready power supply is required)
10
English
1.3 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short. If no jumper cap is placed on the pins, the jumper
is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper
(CLRMOS1)
(see p.1, No. 10)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed.
Clear CMOS
Default
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option “Clear
Status” to clear the record of previous chassis intrusion status.
11
English
H110M-DVS/D3
1.4 Onboard Headers and Connectors
System Panel Header
(9-pin PANEL1)
(see p.1, No. 11)
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
GND
RESET#
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
PWRBTN (Power Switch):
Connect to the power switch on the chassis front panel. You may congure the way to turn
o your system using the power switch.
RESET (Reset Switch):
Connect to the reset switch on the chassis front panel. Press the reset switch to restart the
computer if the computer freezes and fails to perform a normal restart.
PLED (System Power LED):
Connect to the power status indicator on the chassis front panel. e LED is on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Hard Drive Activity LED):
Connect to the hard drive activity LED on the chassis front panel. e LED is on when the
hard drive is reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists of power
switch, reset switch, power LED, hard drive activity LED, speaker and etc. When connect-
ing your chassis front panel module to this header, make sure the wire assignments and the
pin assignments are matched correctly.
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
headers and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.
12
English
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.1, No. 13)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
Serial ATA3 Connectors
(SATA3_0)
(see p.1, No. 9)
(SATA3_1)
(see p.1, No. 8)
(SATA3_2)
(see p.1, No. 6)
(SATA3_3)
(see p.1, No. 7)
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to
6.0 Gb/s data transfer rate.
USB 2.0 Header
(9-pin USB4_5)
(see p.1, No. 12)
DUMMY
GND
GND
+B
-B
USB_PWR
+A
-A
USB_PWR
1
ere is one header on
this motherboard. Each
USB 2.0 header can
support two ports.
USB 3.0 Header
(19-pin USB3_4_5)
(see p.1, No. 5)
1
IntA_PB_D+
Dummy
IntA_PB_D-
GND
IntA_PB_SSTX+
GND
IntA_PB_SSTX-
IntA_PB_SSRX+
IntA_PB_SSRX-
VbusVbus
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
Besides two USB 3.0 ports
on the I/O panel, there
is one header on this
motherboard. Each USB
3.0 header can support
two ports.
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
SATA3_2
SATA3_3
SATA3_0
SATA3_1
13
English
H110M-DVS/D3
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 17)
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GN D
OUT2_R
MIC2_R
MIC2_L
OUT_RET
is header is for
connecting audio devices
to the front audio panel.
Chassis Fan Connector
(4-pin CHA_FAN1)
(see p.1, No. 16)
GND
FAN_VOLTAGE
CHA_FAN_SPEED
FAN_SPEED_CONTROL
Please connect fan cables
to the fan connector and
match the black wire to
the ground pin.
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.1, No. 2)
GND
FAN_VOLTAGE
CPU_FAN_SPEED
FAN_SPEED_CONTROL
1 2 3 4
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis must sup-
port HDA to function correctly. Please follow the instructions in our manual and chassis
manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio header by the
steps below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_RET and OUT_RET are for the HD audio panel only. You don’t need to connect
them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and
adjust “Recording Volume”.
14
English
ATX Power Connector
(24-pin ATXPWR1)
(see p.1, No. 4)
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13.
ATX 12V Power
Connector
(4-pin ATX12V1)
(see p.1, No. 1)
is motherboard pro-
vides a 4-pin ATX 12V
power connector.
Serial Port Header
(9-pin COM1)
(see p.1, No. 15)
is COM1 header
supports a serial port
module.
TPM Header
(17-pin TPMS1)
(see p.1, No. 14)
is connector supports Trusted
Platform Module (TPM) system,
which can securely store keys,
digital certicates, passwords,
and data. A TPM system also
helps enhance network security,
protects digital identities, and
ensures platform integrity.
1
12
13
24
1
GND
SMB_DATA_MAIN
LAD2
LAD1
GND
S_PWRDWN#
SERIRQ#
GND
PCICLK
PCIRST#
LAD3
+3V
LAD0
+3VSB
GND
FRAME
SMB_CLK_MAIN
CCTS#1
RRTS#1
DDSR#1
DDTR#1
RRXD1
GND
TTXD1
DDCD#1
1
RRI#1
15
H110M-DVS/D3
Deutsch
Technische Daten
Plattform
• Micro-ATX-Formfaktor
• Feststoondensator-Design
• Leiterplatte mit hochdichtem Glasgewebe
Prozessor
• Unterstützt die Prozessoren Intel® Core
TM
i7/i5/i3/Pentium®/
Celeron® der 6. Generation (Sockel 1151)
• Unterstützt Intel® Turbo Boost 2.0-Technologie
Chipsatz
• Intel® H110
Speicher
• Dualkanal-DDR3/DDR3L-Speichertechnologie
• 2 x DDR3/DDR3L-DIMM-Steckplätze
• Unterstützt DDR3/DDR3L 1600/1333/1066 non-ECC,
ungepuerter Speicher
• Systemspeicher, max. Kapazität: 32GB
• Unterstützt Intel® Extreme Memory Prole (XMP)1.3/1.2
Erweiter-
ungssteckplatz
• 1 x PCI-Express 3.0-x16-Steckplatz (PCIE1:x16-Modus)
• 2 x PCI-Express 2.0-x1-Steckplätze
Grakkarte
* Integrierte Intel® HD Graphics-Visualisierung und VGA-
Ausgänge können nur mit Prozessoren unterstützt werden, die
GPU-integriert sind.
• Unterstützt integrierte Intel® HD Graphics-Visualisierung:
Intel® Quick Sync Video mit AVC, MVC (S3D) und MPEG-2
Full HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. geteilter Speicher: 1792 MB
• Dualer Grakkartenausgang Unterstützt DVI-D- und
D-Sub-Ports durch unabhängige Monitor-Controller
• Unterstützt DVI-D mit maximaler Auösung von 1920 x
1200 bei 60 Hz
• Unterstützt D-Sub mit maximaler Auösung von 1920 x
1200 bei 60 Hz
16
Deutsch
• Unterstützt beschleunigte Mediencodecs: HEVC, VP8, VP9
• Unterstützt HDCP mit DVI-D-Port
• Unterstützt Blu-ray- (BD) Wiedergabe (Full HD/1080p) mit
DVI-D-Port
Audio
• 7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec)
*Zur Konguration von 7.1-Kanal-HD-Audio müssen Sie ein
HD-Frontblenden-Audiomodul nutzen und den Mehrkanalton
über den Audiotreiber aktivieren.
• Unterstützt Überspannungsschutz (ASRock Full Spike Pro-
tection)
• ELNA-Audiokondensatoren
LAN
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111E
• Unterstützt Wake-On-LAN
• Unterstützt Blitzschutz/Schutz gegen elektrostatische Entla-
dung (ASRock Full Spike Protection)
• Unterstützt LAN-Kabelerkennung
• Unterstützt energieezientes Ethernet 802.3az
• Unterstützt PXE
Rückblende,
E/A
• 1 x PS/2-Maus-/Tastaturanschluss
• 1 x D-Sub-Port
• 1 x DVI-D-Port
• 4 x USB 2.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))
• 2 x USB 3.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))
• 1 x RJ-45-LAN-Port mit LED (Aktivität/Verbindung-LED
und Geschwindigkeit-LED)
• HD-Audioanschlüsse: Line-in / Vorderer Lautsprecher /
Mikrofon
17
H110M-DVS/D3
Deutsch
Speicher
• 4 x SATA-III-6,0-Gb/s-Anschlüsse, unterstützt NCQ, AHCI
und Hot-Plugging
Anschluss
• 1 x COM-Anschluss-Stileiste
• 1 x TPM-Stileiste
• 1 x Gehäuseeingri- und Lautsprecher-Stileiste
• 1 x CPU-Lüeranschluss (4-polig)
(intelligente Lüergeschwindigkeitssteuerung)
• 1 x Gehäuselüeranschluss (4-polig)
(intelligente Lüergeschwindigkeitssteuerung)
• 1 x 24-poliger ATX-Netzanschluss
• 1 x 4-poliger 12-V-Netzanschluss
• 1 x Audioanschluss an Frontblende
• 1 x USB 2.0-Stileiste (unterstützt 2 USB 2.0-Ports) (unter-
stützt Schutz gegen elektrostatische Entladung (ASRock Full
Spike Protection))
• 1 x USB 3.0-Stileiste (unterstützt 2 USB 3.0-Ports) (unter-
stützt Schutz gegen elektrostatische Entladung (ASRock Full
Spike Protection))
BIOS-Funktion
• 128-Mb-AMI-UEFI-Legal-BIOS mit Unterstützung mehr-
sprachiger grascher Benutzerschnittstellen
• ACPI 1.1-konforme Aufweckereignisse
• SMBIOS 2.3.1-Unterstützung
• CPU, GT_CPU, DRAM, PCH 1,0V, VCCIO, VCCSA Mehr-
fachspannungsanpassung
Hardwareüber-
wachung
• CPU-/Gehäusetemperaturerkennung
• CPU-/Gehäuselüertachometer
• Lautloser CPU-/Gehäuselüer (automatische Anpassung der
Gehäuselüergeschwindigkeit durch CPU-Temperatur)
• CPU-/Gehäuselüer-Mehrfachgeschwindigkeitssteuerung
• Gehäuse-oen-Erkennung
• Spannungsüberwachung: +12 V, +5 V, +3,3 V, CPU Vcore,
CPU
18
Deutsch
Betriebssys-
tem
• Microso® Windows® 10, 64 Bit / 8.1, 64 Bit / 7, 32 Bit / 7, 64
Bit
* Zur Installation des Windows® 7-Betriebssystems wird ein
modiziertes Installationslaufwerk mit xHCI-Treibern in der
ISO-Datei benötigt. Detaillierte Anweisungen nden Sie auf Seite
62.
* Einzelheiten zum aktualisierten Windows® 10-Treiber
entnehmen Sie bitte der ASRock-Webseite:
http://www.asrock.com
Zerti-
zierungen
• FCC, CE, WHQL
• ErP/EuP ready (ErP/EuP ready-Netzteil erforderlich)
Bitte beachten Sie, dass mit einer Übertaktung, zu der die Anpassung von BIOS-Einstellungen,
die Anwendung der Untied Overclocking Technology oder die Nutzung von Übertaktung-
swerkzeugen von Drittanbietern zählen, bestimmte Risiken verbunden sind. Eine Übertaktung
kann sich auf die Stabilit Ihres Systems auswirken und sogar Komponenten und Geräte Ihres
Systems beschädigen. Sie sollte auf eigene Gefahr und eigene Kosten durchgeführt werden.
Wir übernehmen keine Verantwortung für mögliche Schäden, die durch eine Übertaktung
verursacht wurden.
* Detaillierte Produktinformationen nden Sie auf unserer Webseite: http://www.asrock.com
19
H110M-DVS/D3
Français
Spécications
Plateforme
• Facteur de forme Micro ATX
• Conception à condensateurs solides
• PCB en tissu de verre haute densité
Processeur
• Prend en charge les processeurs 6
e
génération Intel® Core
TM
i7/
i5/i3/Pentium®/Celeron® (Socket 1151)
• Prend en charge la technologie Intel® Turbo Boost 2.0
Chipset
• Intel® H110
Mémoire
• Technologie mémoire double canal DDR3/DDR3L
• 2 x fentes DIMM DDR3/DDR3L
• Prend en charge les mémoires sans tampon non ECC DDR3/
DDR3L 1600/1333/1066
• Capacité max. de la mémoire système : 32Go
• Prend en charge Intel® Extreme Memory Prole (XMP)1.3/1.2
Fente
d’expansion
• 1 x fente PCI Express 3.0 x 16 (PCIE1:mode x16)
• 2 x fentes PCI Express 2.0 x1
Graphiques
* La technologie Intel® HD Graphics Built-in Visuals et les sorties
VGA sont uniquement prises en charge par les processeurs
intégrant un contrôleur graphique.
• Prend en charge la technologie Intel® HD Graphics Built-in
Visuals : Intel® Quick Sync Video avec AVC, MVC (S3D) et
MPEG-2 Full HW Encode1, Intel® InTru
TM
3D, Intel® Clear
Video HD Technology, Intel® Insider
TM
, Intel® HD Graphics
510/530
• Pixel Shader 5.0, DirectX 12
• Mémoire partagée max. 1792Mo
• Double sortie graphique: Prend en charge les ports D-Sub et
DVI-D via contrôleurs dachage indépendants
• Prend en charge le mode DVI-D avec une résolution maximale
de 1920x1200 @ 60Hz
• Prend en charge le mode D-Sub avec une résolution maximale
de 1920x1200 @ 60Hz
20
Français
• Prend en charge les codecs multimédias accélérés: HEVC,
VP8, VP9
• Prend en charge HDCP via port DVI-D
• Prend en charge la lecture Blu-ray (BD) Full HD 1080p via
port DVI-D
Audio
• Audio 7.1 CH HD (Codec audio Realtek ALC887)
*Pour congurer laudio 7.1 CH HD, il est nécessaire d’utiliser un
module audio HD pour panneau frontal et dactiver la fonction
audio multicanal via le pilote audio.
• Protection contre les surtensions (Protection complète contre
les pics ASRock)
• Capuchons ELNA Audio
Réseau
• PCIE x1 Gigabit LAN 10/100/1000 Mo/s
• Realtek RTL8111E
• Prend en charge la fonction Wake-On-LAN
• Protection contre les orages/décharges électrostatiques
(Protection complète contre les pics ASRock)
• Prend en charge la détection de câble LAN
• Prend en charge la fonction déconomie dénergie Ethernet
802.3az
• Prend en charge PXE
Connectique
du panneau
arrière
• 1 x port souris/clavier PS/2
• 1 x port D-Sub
• 1 x port DVI-D
• 4 x ports USB 2.0 (Protection contre les décharges électrosta-
tiques (Protection complète contre les pics ASRock))
• 2 x ports USB 3.0 (Protection contre les décharges électrosta-
tiques (Protection complète contre les pics ASRock))
• 1 x port RJ-45 LAN avec LED (LED ACT/LIEN et LED
VITESSE)
• Connecteurs jack audio HD : Entrée ligne / haut-parleur avant
/ microphone
21
H110M-DVS/D3
Français
Stockage
• 4 x connecteurs SATA3 6,0 Gb/s, compatibles avec les fonc-
tions NCQ, AHCI et «Hot Plug»
Connecteur
• 1 x embase pour port COM
• 1 x embase TPM
• 1 x prise DEL dalimentation et emplacement sur châssis
• 1 x connecteur pour ventilateur de processeur (4 broches)
(contrôle de vitesse de ventilateur intelligent)
• 1 x connecteur pour ventilateur de châssis (4 broches)
(contrôle de vitesse de ventilateur intelligent)
• 1 x connecteur dalimentation ATX 24 broches
• 1 x connecteur dalimentation 12V 4 broches
• 1 x connecteur audio panneau frontal
• 1 x embase USB 2.0 (2 ports USB 2.0 pris en charge)
(Protection contre les décharges électrostatiques (Protection
complète contre les pics ASRock))
• 1 x embase USB 3.0 (2 ports USB 3.0 pris en charge)
(Protection contre les décharges électrostatiques (Protection
complète contre les pics ASRock))
Caractéristiques
du BIOS
• BIOS UEFI AMI 128Mo avec prise en charge d’interface
graphique multilingue
• Compatible ACPI 1.1 Wake Up Events
• Prend en charge SMBIOS 2.3.1
• Réglage de la tension CPU, GT_CPU, DRAM, PCH 1,0V, VC-
CIO, VCCSA
Surveillance du
matériel
• Détection de la température du processeur/châssis
• Tachéomètre ventilateur processeur/châssis
• Ventilateur silencieux processeur/châssis (réglage automatique
de la vitesse du ventilateur du châssis d’après la température
du processeur)
• Contrôle simultané des vitesses des ventilateurs processeur/
châssis
• Détection CHASSIS OUVERT
• Surveillance de la tension dalimentation : +12V, +5V, +3,3V,
CPU Vcore, CPU
22
Français
Système
d’exploitation
• Microso® Windows® 10 64 bits / 8.1 64 bits / 7 32 bits / 7 64
bits
* Pour installer Windows® 7, un disque d'installation modié avec
les pilotes xHCI intégrés au chier ISO est requis. Reportez-vous
à la page 62 pour des instructions plus détaillées.
* Pour le pilote mis à jour pour Windows® 10, veuillez visiter le
site Web d'ASRock pour plus de détails:http://www.asrock.com
Certications
• FCC, CE, WHQL
• ErP/EuP Ready (alimentation ErP/EuP ready requise)
Il est important de signaler que l’overcloking présente certains risques, incluant des modica-
tions du BIOS, lapplication dune technologie doverclocking déliée et l’utilisation doutils
d’overclocking développés par des tiers. La stabilité de votre système peut être aectée par ces
pratiques, voire provoquer des dommages aux composants et aux périphériques du système.
Loverclocking se fait à vos risques et périls. Nous ne pourrons en aucun cas être tenus pour
responsables des dommages éventuels provoqués par loverclocking.
* pour des informations détaillées de nos produits, veuillez visiter notre site: http://www.asrock.com
23
H110M-DVS/D3
Italiano
Speciche
Piattaforma
• Fattore di forma Micro ATX
• Design condensatore solido
• PBC di bra di vetro ad alta densità
CPU
• Supporta processori 6
th
Generation Intel® Core
TM
i7/i5/i3/
Pentium®/Celeron® (Socket 1151)
• Supporta la tecnologia Intel® Turbo Boost 2.0
Chipset
• Intel® H110
Memoria
• Tecnologia con memoria DDR3/DDR3L a doppio canale
• 2 alloggi DIMM DDR3/DDR3L
• Supporta la memoria DDR3/DDR3L 1600/1333/1066 non
ECC, senza buer
• Capacità max. della memoria di sistema: 32 GB
• Supporta Intel® Extreme Memory Prole (XMP)1.3/1.2
Alloggio
d’espansione
• 1 alloggio PCI Express 3.0 x16 (PCIE1:modalità x16)
• 2 alloggi PCI Express 2.0 x1
Graca
*Le uscite Intel® HD Graphics Built-in Visualse VGA possono
essere supportate solo con processori dotati di GPU integrata.
• Supporta la videograca integrata della scheda video HD
Intel®: Intel® Quick Sync Video con AVC, MVC (S3D) e
MPEG-2 Full HW Encode1, Intel® InTru
TM
3D, tecnologia
Intel® Clear Video HD, Intel® Insider
TM
, Intel® HD Graphics
510/530
• Pixel Shader 5.0, DirectX 12
• Memoria condivisa max. 1792 MB
• Doppia uscita graca: Supporto di porte DVI-D e D-Sub
tramite controller display indipendenti
• Supporta DVI-D con una risoluzione max. no a 1920 x
1200 a 60 Hz
• Supporta D-Sub con una risoluzione max. no a 1920 x
1200 a 60 Hz
24
Italiano
• Supporto accelerazione codec multimediale: HEVC, VP8,
VP9
• Supporto di HDCP con le porta DVI-D
• Supporto di riproduzione Full HD 1080p Blu-ray (BD) con
le porta DVI-D
Audio
• Audio HD 7.1 CH (codec audio Realtek ALC887)
* Per congurare laudio HD 7.1 canali, è necessario utilizzare
un modulo pannello frontale audio HD ed attivare la funzione
audio multicanale tramite il driver audio.
• Supporto protezione da sovratensione (protezione completa
ASRock dai picchi di corrente)
• Cappucci audio ELNA
LAN
• PCIE x 1 LAN Gigabit 10/100/1000 Mb/s
• Realtek RTL8111E
• Supporta Wake-On-LAN
• Supporto la protezione da fulmini/scariche elettrostatiche
(ESD) (protezione completa ASRock dai picchi di corrente)
• Supporta il rilevamento cavo LAN
• Supporta Energy Ecient Ethernet 802.3az
• Supporta PXE
I/O pannello
posteriore
• 1 x porta mouse/tastiera PS/2
• 1 x porta D-Sub
• 1 x porta DVI-D
• 4 x Porte USB 2.0 (supporto protezione da scariche elettro-
statiche (ESD) (protezione completa ASRock dai picchi di
corrente))
• 2 x Porte USB 3.0 (supporto protezione da scariche elettro-
statiche (ESD) (protezione completa ASRock dai picchi di
corrente))
• 1 x porta LAN RJ-45 con LED (ACT/LINK LED e SPEED
LED)
• Connettori audio HD: Ingresso linea / altoparlante frontale
/ microfono
25
H110M-DVS/D3
Italiano
Archiviazi-
one
• 4 x connettori SATA3 6.0 Gb/s supportano NCQ, AHCI e
Hot Plug
Connettore
• 1 x collettore porta COM
• 1 x Collettore TMP
• 1 x collegamento altoparlante e intrusione telaio
• 1 x Connettore ventola CPU (4 pin)
(Smart Fan Speed Control)
• 1 x connettore ventola telaio (4 pin)
(Smart Fan Speed Control)
• 1 x connettore alimentazione ATX 24 pin
• 1 x Connettore alimentazione 12V 4-pin
• 1 x connettore audio pannello frontale
• 1 x Collettore USB 2.0 (supporta 2 porte USB 2.0) (supporto
protezione da scariche elettrostatiche (ESD) (protezione
completa ASRock dai picchi di corrente))
• 1 x Collettore USB 3.0 (supporta 2 porte USB 3.0) (supporto
protezione da scariche elettrostatiche (ESD) (protezione
completa ASRock dai picchi di corrente))
Funzionalità
BIOS
• AMI UEFI Legal BIOS 128Mb con interfaccia di supporto
multilingue
• Eventi di riattivazione conformi a ACPI 1.1
• Supporto SMBIOS 2.3.1
• Regolazione variabile tensione CPU, GT_CPU, DRAM, PCH
1,0V, VCCIO, VCCSA
Hardware
Monitor
• Rilevamento temperatura CPU/telaio
• Tachimetro ventola CPU/telaio
• Ventola silenziosa CPU/telaio (regolazione automatica veloc-
ità in base alla temperatura della CPU)
• Ventola CPU/telaio con controllo di varie velocità
• Rilevamento CASE OPEN
• Monitoraggio tensione: +12V, +5V, +3,3V, CPU Vcore, CPU
26
Italiano
SO
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* Per installare Windows® 7, è necessario un disco di installazione
modicato con i driver xHCI integrati nel le ISO. Fare riferi-Fare riferi-
mento a pagina 62 per altre istruzioni dettagliate.
* Per il driver aggiornato di Windows® 10, visitare il sito ASRock
all'indirizzo: http://www.asrock.com
Certica-
zioni
• FCC, CE, WHQL
• ErP/EuP Ready (è necessaria alimentazione ErP/EuP ready)
Prestare attenzione al potenziale rischio previsto nella pratica di overclocking, inclusa la
regolazione delle impostazioni nel BIOS, l'applicazione di tecnologia di Untied Overclocking o
l'utilizzo di strumenti di overclocking di terze parti. L'overclocking può inuenzare la stabili
del sistema o perno provocare danni ai componenti e ai dispositivi del sistema. Occorre
eseguirlo a proprio rischio e spese. Non ci riterremo responsabili per possibili danni provocati da
overclocking.
* Per informazioni dettagliate sul prodotto, visitare il nostro sito Web: http://www.asrock.com
27
H110M-DVS/D3
Español
Especicaciones
Plataforma
• Factor de forma Micro ATX
• Diseño de condensador sólido
• PCB de bra de vidrio de alta densidad
CPU
• Admite la familia de procesadores Intel® Core
TM
i7/i5/i3/
Pentium®/Celeron® (zócalo 1151) de la 6ª generación
• Compatible con la tecnología de Intel® Turbo Boost 2.0
Conjunto
de chips
• Intel® H110
Memoria
• Tecnología de memoria de Doble Canal DDR3/DDR3L
• 2 ranuras DDR3/DDR3L DIMM
• Compatible con memoria no-ECC, sin búfer DDR3/DDR3L
1600/1333/1066
• Capacidad máxima de la memoria del sistema: 32GB
• Compatible con Extreme Memory Prole (XMP)1.3/1.2 de
Intel®
Ranura de
expansión
• 1 ranura PCI Express 3.0 x16 (PCIE1:modo x16)
• 2 ranuras PCI Express 2.0 x1
Grácos
* La Tecnología visual integrada de grácos HD de Intel® y las
salidas de VGA son compatibles únicamente con procesadores
con GPU integrado.
• Compatible con la Tecnología visual integrada de grácos
HD de Intel®: Intel® Quick Sync Video con AVC, MVC (S3D)
y MPEG-2 Full HW Encode1, Intel® InTru
TM
3D, Intel® Clear
Video HD Technology, Intel® Insider
TM
, Intel® HD Graphics
510/530
• Pixel Shader 5.0, DirectX 12
• Memoria compartida máxima: 1792MB
• Salida gráca dual: compatible con puertos DVI-D y D-Sub
mediante controladores de pantalla independientes
• Compatible con DVI-D con máxima resolución hasta
1920x1200 @ 60Hz
• Compatible con D-Sub con máxima resolución hasta
1920x1200 @ 60Hz
28
Español
• Admite códecs multimedia acelerados: HEVC, VP8, VP9
• Compatible con función HDCP con puerto DVI-D
• Compatible con reproducción Blu-ray (BD) Full HD de 1080p
con puerto DVI-D
Audio
• 7.1 Audio CH HD (Códec de audio Realtek ALC887)
*Para congurar 7.1 Audio CH HD, deberá utilizar un módulo del
panel frontal de audio HD y habilitar la característica de audio mul-
ticanal a través del controlador de audio.
• Compatible con protección por sobretensión (protección ASRock
Full Spike)
• Tapas de audio ELNA
LAN
• 1 LAN Gigabit PCIE 10/100/1000 Mb/s
• Realtek RTL8111E
• Compatible con Wake-On-LAN
• Compatible con protección contra rayos y electricidad elec-
trostática (protección ASRock Full Spike)
• Admite la detección de cable LAN
• Compatible con Ethernet de consumo eciente de energía
802.3az
• Compatible con PXE
Panel trasero
I/O
• 1 puerto de ratón/teclado PS/2
• 1 puerto D-Sub
• 1 puerto DVI-D
• 4 puertos USB 2.0 (compatible con protección contra electricidad
estática (protección ASRock Full Spike))
• 2 puertos USB 3.0 (compatible con protección contra electricidad
estática (protección ASRock Full Spike))
• 1 puerto LAN RJ-45 con LED (ACT/LINK LED y SPEED LED)
• Conector de audio HD: Entrada de línea / Altavoz frontal /
Micrófono
29
H110M-DVS/D3
Español
Alma-
cenamiento
• 4 conectores SATA3 de 6,0 Gb/s, compatibles con las funciones
NCQ, AHCI y “Hot Plug
Conector
• 1 Cabezal de puerto COM
• 1 cabezal TPM
• 1 cabezal de intrusión de chasis y de altavoces
• 1 Conector (4 contactos) para el ventilador de la CPU (control de
velocidad de ventilador inteligente)
• 1 Conectores (4 contactos) para el ventilador del chasis (control
de velocidad de ventilador inteligente)
• 1 Conector de alimentación ATX de 24 pines
• 1 conector de alimentación de 12V de 4 pines
• 1 Conector de audio del panel frontal
• 1 cabezal USB 2.0 (compatible con 2 puertos USB 2.0) (compatible
con protección contra electricidad estática (protección ASRock
Full Spike))
• 1 cabezal USB 3.0 (compatible con 2 puertos USB 3.0) (compatible
con protección contra electricidad estática (protección ASRock
Full Spike))
Función del
BIOS
• BIOS legal UEFI AMI de 128Mb compatible con interfaz gráca
de usuario multilingüe
• Eventos de reactivación conformes con ACPI 1.1
• Compatible con SMBIOS 2.3.1
• Multi-ajuste de voltaje de CPU, GT_CPU, DRAM, PCH 1,0V, VC-
CIO y VCCSA
Monitor del
hardware
• Método de sensor de temperatura de la CPU/Chasis
• Tacómetro del ventilador de la CPU/Chasis
• CPU/Chasis Ventilador silencioso (Ajuste automático de veloci-
dad del ventilador del chasis por temperatura de la CPU)
• Control multivelocidad del ventilador de la CPU/Chasis
• Detección de CUBIERTA ABIERTA
• Control de voltaje: +12V, +5V, +3,3V, CPU Vcore, CPU
30
Español
SO
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* Para instalar el sistema operativo Windows® 7, se necesita un disco
de instalación modicado con los controladores xHCI empaquetados
en el archivo ISO. Consulte la página 62 para obtener información
más detallada.
* Para obtener el controlador actualizado para Windows® 10, visite el
sitio Web desde ASRock para obtener detalles:
http://www.asrock.com
Certica-
ciones
• FCC, CE, WHQL
• Compatible con ErP/EuP (requiere toma de alimentación compat-
ible con ErP/EuP)
Tenga en cuenta que existen ciertos riesgos relacionados con el overclocking (sobreaceleración),
incluyendo el ajuste de la conguración del BIOS, aplicando la Tecnología overcloking no vincu-
lada o utilizando las herramientas de overclocking de tercera parte. El overclocking podría afectar
la estabilidad de su sistema o incluso dañar los componentes y dispositivos de su sistema. Si lo
realiza, todos los riesgos y gastos derivados del overclocking serán de su entera responsabilidad. No
nos hacemos responsables de posibles daños producidos por el overclocking.
* Para obtener más información acerca del producto, visite nuestro sitio web: http://www.asrock.com
31
H110M-DVS/D3
Русский


• - Micro ATX
•     
•       

•   6-

 Intel® Core
TM
i7/i5/
i3/Pentium®/Celeron® (Socket 1151)
•   Intel® Turbo Boost 2.0

• Intel® H110

•   DDR3/DDR3L
• 2 x  DDR3/DDR3L DIMM
•    DDR3/DDR3L 1600/1333/1066
Non-ECC Unbuered
•    : 32 
•  Intel® Extreme Memory Prole (XMP)1.3/1.2


• 1 x  PCI Express 3.0 x16 (PCIE1: x16)
• 2 x PCI Express 2.0 x1 


*   Intel® HD Graphics Built-in Visuals
 VGA      
  .
•     Intel® HD
Graphics: Intel® Quick Sync Video  AVC, MVC (S3D)  MPEG-
2 Full HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
•     : 1792 
•   :   DVI-D  D-Sub
  
•  DVI-D     1920x1200
 60 
•  D-Sub     1920x1200
 60 
32
Русский
•    : HEVC, VP8, VP9
•    HDCP   DVI-D
•     Full HD 1080p Blu-ray
(BD)   DVI-D

• 7.1-    ( Realtek
ALC887)
*  7.1-    HD Audio
   HD   
   .
•    (ASRock Full Spike Protection)
•    ELNA
LAN
• PCIE x1 Gigabit LAN 10/100/1000 /
• Realtek RTL8111E
•  Wake-On-LAN
•    
 (ASRock Full Spike Protection)
•    
•  Energy Ecient Ethernet 802.3az
•  PXE
 -

 

• 1 x PS/2  /
• 1 x D-Sub
• 1 x DVI-D
• 4 x  USB 2.0    
 (ASRock Full Spike Protection)
• 2 x  USB 3.0    
 (ASRock Full Spike Protection)
• 1 x RJ-45     ( ACT/LINK   SPEED)
•  HD Audio:   /  
/ 


• 4 x  SATA3 6,0 /,   NCQ,
AHCI  «» 
33
H110M-DVS/D3
Русский

• 1 x  -
• 1 x  
• 1       

• 1 x     
(4-) (“”  
)
• 1 x     (4-)
(-   )
• 1     (24-)
• 1 x 4-   12 
• 1 x    
• 1 x  USB 2.0 ( 2  USB 2.0)   
  (ASRock Full Spike Pro-
tection)
• 1 x  USB 3.0 ( 2  USB 3.0)   
  (ASRock Full Spike Pro-
tection)
 BIOS
• AMI UEFI Legal BIOS 128   
  
•     
 ACPI 1.1
•  SMBIOS 2.3.1
•   , GT_CPU, DRAM, PCH 1,0,
VCCIO, VCCSA


•   /
•   /
•    /
(     
    )
•    
 /
•    
•  : +12, +5, +3,3, 
 , 
34
Русский
 ,   ,    BIOS,
  Untied Overclocking Technology   
  ,    . 
         
    .     
      .      
,   .
*         -:
http://www.asrock.com

• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
*    Windows® 7  
    xHCI,  
 ISO.     
. 62.
*      Windows® 10
  - ASRock: http://www.asrock.com

• FCC, CE, WHQL
•   ErP/EuP (  ,
  ErP/EuP)
35
H110M-DVS/D3
Português
Especicações
Plataforma
• Micro ATX Form Factor
• Design de condensador sólido
• Tecido de Vidro de Alta densidade PCB
CPU
• Supports Processadores Intel® 6
ª
Geração Core
TM
i7/i5/i3/
Pentium®/Celeron® (Soquete 1151)
• Suporta a tecnologia Intel® Turbo Boost 2.0
Chipset
• Intel® H110
Memória
• Tecnologia de memória DDR3/DDR3L de dois canais
• 2 x Slots DIMM DDR3/DDR3L
• Suporta memória DDR3/DDR3L 1600/1333/1066, não ECC,
sem memória intermédia
• Capacidade máxima da memória do sistema: 32GB
• Suporta Extreme Memory Prole (XMP)1.3/1.2 da Inte
Slot de
expansão
• 1 x Slot PCI Express 3.0 x16 (PCIE1:modo x16)
• 2 x Slots PCI Express 2.0 x1
Grácos
* Os grácos incorporados Intel® HD e as saídas VGA só podem
ser suportados com processadores com GPU integrada.
• Suporta grácos incorporados Intel® HD: Intel® Quick Sync
Video com AVC, MVC (S3D) e MPEG-2 Full HW Encode1,
Intel® InTru
TM
3D, Tecnologia Intel® Clear Video HD, Intel®
Insider
TM
, Grácos Intel® HD 510/530
• Pixel Shader 5.0, DirectX 12
• Memória compartilhada máxima de 1792MB
• Saída gráca dupla: Suporta portas DVI-D e D-Sub por
controladores de vídeo independentes
• Suporta DVI-D com resolução máxima de até 1920x1200 @
60Hz
• Suporta D-Sub com resolução máxima de até 1920x1200 @
60Hz
36
Português
• Suporta Codecs de Mídia Acelerada: HEVC, VP8, VP9
• Suporta HDCP com Porta DVI-D
• Suporta reprodução Full HD 1080p Blu-ray (BD) com Porta
DVI-D
Áudio
• Áudio HD de 7.1 canais com proteção de conteúdo (Codec de
áudio Realtek ALC887)
*Para congurar Áudio 7.1 CH HD, é necessário usar um módulo
de áudio de painel frontal HD e habilitar o recurso de áudio
multi-canal pelo driver de áudio.
• Suporta proteção contra sobretensão (Proteção Total Contra
Picos ASRock)
• Fones de Áudio ELNA
LAN
• LAN Gigabit 10/100/1000 Mb/s PCIE x1
• Realtek RTL8111E
• Suporta Wake-On-LAN
• Suporta Proteção contra Relâmpago/EDS (Proteção Total
Contra Picos ASRock)
• Suporta Detecção de Cabo LAN
• Suporta Energy Ecient Ethernet 802.3az
• Suporta PXE
E/S do pai-
nel poste-
rior
• 1 x Porta PS/2 para mouse/teclado
• 1 x Porta D-Sub
• 1 x Porta DVI-D
• 4 x Portas USB 2.0 (Suporta Proteção ESD (Proteção Total
Contra Picos ASRock))
• 2 x Portas USB 3.0 (Suporta Proteção ESD (Proteção Total
Contra Picos ASRock))
• 1 x Porta LAN RJ-45 com LED (LED ACT/LINK e LED DE
VELOCIDADE)
• Fichas de áudio HD: Entrada de Linha / Autofalante Frontal /
Microfone
37
H110M-DVS/D3
Português
Armazena-
mento
• 4 x Conectores SATA3 6,0 Gb/s, suporte NCQ, AHCI, Conec-
tor a Quente
Conector
• 1 x suporte porta COM
• 1 x Plataforma TPM
• 1 x Intrusão do Chassi e Cabeçote de Autofalante
• 1 x Conector de Ventoinha de CPU (4 pinos) (Controle de
Velocidade de Ventoinha Inteligente)
• 1 x Conector de Ventoinha de Chassi (4 pinos) (Controle de
Velocidade de Ventoinha Inteligente)
• 1 x conector alimentação ATX 24 pinos
• 1 x Conector de energia 4-pinos 12V
• 1 x conector de áudio do painel frontal
• 1 x Plataforma USB 2.0 (Suporta 2 portas USB 2.0) (Suporta
Proteção ESD (Proteção Total Contra Picos ASRock))
• 1 x Plataforma USB 3.0 (Suporta 2 portas USB 3.0) (Suporta
Proteção ESD (Proteção Total Contra Picos ASRock))
Funções
da BIOS
• 128Mb IAM Legal UEFI BIOS com suporte multilingue GUI
• ACPI 1.1 compatível com eventos de despertar
• Suporta SMBIOS 2.3.1
• CPU, GT_CPU, DRAM, PCH 1,0V, VCCIO, VCCSA Multi
ajuste de tensão
Monitor de
hardware
• Sensor de temperatura da CPU/Gabinete
• Tacômetro da Ventoinha da CPU/Gabinete
• Ventoinha silenciosa da CPU/Gabinete (Auto ajusta veloci-
dade da ventoinha do gabinete pela temperatura da CPU)
• Controle de multi velocidade da Ventoinha da CPU/Gabinete
• Detecção de ABERTURA da CAIXA
• Monitoramento da tensão: +12V, +5V, +3,3V, CPU Vcore,
CPU
SO
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
*Para instalar o SO Windows 7, um disco de instalação
modicado com condutores xHCI no arquivo ISO é necessário.
Consulte a página 62 para a operação mais detalhada.
* Para o driver atualizado do Windows® 10, por favor, visite o
website da ASRock para mais detalhes: http://www.asrock.com
38
Português
Certi-
cações
• FCC, CE, WHQL
• Preparada para ErP/EuP (é necessária uma fonte de alimen-
tação preparada para ErP/EuP)
Por favor, observe que existe um certo risco envolvendo overclocking, incluindo o ajuste das
denições na BIOS, a aplicação de tecnologia Untied Overclocking ou a utilização de ferra-
mentas de overclocking de terceiros. O overclocking poderá afetar a estabilidade do sistema ou
mesmo causar danos nos componentes e dispositivos do seu sistema. Ele deve ser realizado por
sua conta e risco. Não nos responsabilizamos por possíveis danos causados pelo overclocking.
* Para obter informações detalhadas sobre o produto, por favor, visite o nosso site: http://www.asrock.com
39
H110M-DVS/D3
Türkçe
Özellikler
Platform
• Micro ATX Form Faktörü
• Yekpare Kapasitör tasarımı
• Yüksek Yoğunluklu Cam Elyaf PCB
CPU
• 6. Nesil Intel® Core
TM
i7/i5/i3/Pentium®/Celeron® İşlemcileri
destekler (Yuva 1151)
• Intel® Turbo Boost 2.0 Teknolojisini destekler
Yonga kümesi
• Intel® H110
Bellek
• Çi Kanallı DDR3/DDR3L Bellek Teknolojisi
• 2 x DDR3/DDR3L DIMM Yuvası
• DDR3/DDR3L 1600/1333/1066 ECC olmayan, ara belleğe
alınmamış belleği destekler
• Maksimum sistem belleği kapasitesi: 32GB
• Intel® Üstün Bellek Proli (XMP)1.3/1.2 özelliğini destekler
Genişletme
Yuvası
• 1 x PCI Express 3.0 x16 Yuva (PCIE1:x16 modu)
• 2 x PCI Express 2.0 x1 Yuva
Grakler
Intel® HD Grak Yerleşik Görselleri ve VGA çıkışları yalnızca
GPU tümleşik işlemcilerle desteklenebilir.
• Intel® HD Graphics Dahili Görsellerini destekler : AVC, MVC
(S3D) ve MPEG-2 Full HW Encode1, Intel® InTru
TM
3D,
Intel® Net Video HD Teknolojisi, Intel® Insider
TM
, Intel® HD
Graphics 510/530 ile Intel® Quick Sync Video
• Pixel Shader 5.0, DirectX 12
• Maksimum paylaşılan bellek 1792MB
• Çi grak çıkışı: Bağımsız ekran denetleyicileriyle DVI-D ve
D-Sub bağlantı noktalarını destekler
• 1920x1200 @ 60Hz'ye kadar DVI-D işlevini destekler
• 1920x1200 @ 60Hz'ye kadar D-Sub işlevini destekler
40
Türkçe
• Hızlandırılmış Medya Kodlayıcıları-Kod Çözücüleri Destekler
HEVC, VP8, VP9
• DVI-D Bağlantı Noktalarıyla HDCP destekler
• DVI-D Bağlantı Noktalarıyla Tam HD 1080p Blu-ray (BD)
kayıttan yürütme destekler
Ses
• 7.1 Kanal HD Ses (Realtek ALC887 Ses Kodlayıcı)
*7.1 CH HD Ses kongürasyonu için bir HD ön panel ses
modülü kullanılmalı ve çok kanallı ses özelliği ses sürücüsüsü ile
etkinleştirilmelidir.
• Dalgalanma Koruması Destekler (ASRock Tam Ani Gerilim
Koruması)
• ELNA Ses Kapakları
LAN
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111E
• LAN Açılışını Destekler
• Yıldırım/ESD Koruması Destekler (ASRock Tam Ani Gerilim
Koruması)
• LAN Kablosu Algılama destekler
• Enerji Verimliliğine Sahip Ethernet 802.3az işlevini destekler
• PXE özelliğini destekler
Arka Panel
I/O
• 1 x PS/2 Fare/Klavye Bağlantı Noktası
• 1 x D-Sub Bağlantı Noktası
• 1 x DVI-D Bağlantı Noktası
• 4 x Bağlayıcısı USB 2.0 Bağlantı Noktası (ESD Koruması
Destekler (ASRock Tam Ani Gerilim Koruması))
• 2 x Bağlayıcısı USB 3.0 Bağlantı Noktası (ESD Koruması
Destekler (ASRock Tam Ani Gerilim Koruması))
• LED'e sahip 1 x RJ-45 LAN Bağlantı Noktası (ACT/LINK
LED ve SPEED LED)
• HD Ses Jakları: Hat Girişi / Ön Hoparlör / Mikrofon
Depolama
• 4 x SATA3 6,0 Gb/sn Bağlayıcı, NCQ, AHCI ve Tak Çalıştır
destekler
41
H110M-DVS/D3
Türkçe
Bağlayıcı
• 1 x COM Bağlantı Noktası Bağlantısı
• 1 x TPM Bağlantısı
• 1 x Kasa Yetkisiz Erişim ve Hoparlör Bağlantısı
• 1 x İşlemci Fanı Bağlayıcısı (4 pimli) (Akıllı Fan Hızı Kon-
trolü)
• 1 x Kasa Fanı Bağlayıcı (4 pimli) (Akıllı Fan Hızı Kontrolü)
• 1 x 24 pim ATX Güç Bağlayıcısı
• 1 x 4 pim 12V Güç Bağlayıcısı
• 1 x Ön Panel Ses Bağlayıcısı
• 1 x USB 2.0 Bağlantısı (2 USB 2.0 bağlantı noktası destekler)
(ESD Koruması Destekler (ASRock Tam Ani Gerilim
Koruması))
• 1 x USB 3.0 Bağlantısı (2 USB 3.0 bağlantı noktası destekler)
(ESD Koruması Destekler (ASRock Tam Ani Gerilim
Koruması))
BIOS
Özelliği
• Çok dilli GUI desteği ile 128Mb AMI UEFI Legal BIOS
• ACPI 1.1 Uyumlu uyandırma olayları
• SMBIOS 2.3.1 Desteği
• CPU, GT_CPU, DRAM, PCH 1,0V, VCCIO, VCCSA Gerilimi
Çoklu Ayarlama
Donanım
Monitörü
• CPU/Kasa sıcaklığı tespiti
• CPU/Kasa Fanı Devirölçer
• CPU/Kasa Sessiz Fan (İşlemci sıcaklığıyla otomatik ayarlı kasa
fanı hızı)
• CPU/Kasa Fanı çoklu hız kontro
• KASA AÇIK algılaması
• Voltaj izleme: +12V, +5V, +3,3V, İşlemci Vcore, İşlemci
OS
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* Windows® 7 işletim sistemini yüklemek için, ISO dosyasında
sıkıştırılmış xHCI sürücülerine sahip değiştirilmiş yükleme
diski gereklidir. Daha ayrıntılı talimatlar için lütfen 62 sayfaya
başvurun.
* Güncellenmiş Windows® 10 sürücüsü konusunda ayrıntılar için
lütfen ASRock web sitesini ziyaret edin: http://www.asrock.com
42
Türkçe
tfen, BIOS ayarlarını düzenleme, Bağımsız Hız Aşırtma Teknolojinin uygulanması ya da
üçüncü kişilerin hız aşırtma araçlarının kullanılması da dahil olmak üzere tüm hız aşırtma
işlemlerinin belirli bir risk taşıdığını unutmayın. Hız aşırtma, sisteminizin dayanıklılığını
etkileyebilir, hatta sisteminizde yer alan bileşen ve aygıtlara zarar verebilir. Bunu riski ve
masraarı size ait olmak üzere gerçekleştirilmelidir. Hız aşırtmadan doğabilecek zararlar
konusunda sorumlu olmayacağız.
* Detaylı ürün bilgisi için, lütfen web sitemizi ziyaret edin: http://www.asrock.com
Belgeler
• FCC, CE, WHQL
• ErP/EuP için hazır (ErP/EuP için hazır güç beslemesi ger-
eklidir)
43
H110M-DVS/D3
규격
플랫폼
Micro ATX 팩터
솔리드 콘덴서 구조
고밀도 유리 직물 PCB
CPU
6 세대 Intel® Core
TM
i7/i5/i3/Pentium®/Celero프로세서 (
1151) 지원
Intel® Turbo Boost 2.0 기술 지원
칩세트
Intel® H110
메모리
듀얼 채널 DDR3/DDR3L 메모리 기술
DDR3/DDR3L DIMM 슬롯 2
DDR3/DDR3L 1600/1333/1066 ECC, 비버퍼링 메모리
시스템 메모리 최대 용량 : 32GB
Intel® Extreme Memory Prole (XMP)1.3/1.2 지원
확장 슬롯
PCI Express 3.0 x16 슬롯 1 (PCIE1:x16 모드 )
PCI Express 2.0 x1 슬롯 2
그래픽
* Intel® HD 그래픽스 빌트 - 비주얼과 VGA 출력은 GPU
프로세서로만 지원할 있습니다 .
Intel® HD 그래픽스 빌트 - 비주얼 지원 : AVC, MVC
(S3D) MPEG-2 HW Encode1 지원 Intel® Quick Sync
Video, Intel® InTru
TM
3D, Intel® 클리어 비디오 HD 기술 ,
Intel® Insider
TM
, Intel® HD 그래픽스 510/530
Pixel Shader 5.0, DirectX 12
최대 공유 메모리 1792MB
이중 그래픽 출력 : 독립적 디스플레이 컨트롤러로 DVI-D
D-Sub 포트 지원
DVI-D 지원 ( 최대 해상도 1920x1200 @ 60Hz)
D-Sub 지원 ( 최대 해상도 1920x1200 @ 60Hz)
가속화된 미디어 코덱 지원 : HEVC, VP8, VP9
DVI-D 포트를 이용한 HDCP 지원
DVI-D 포트를 이용한 Full HD 1080p Blu-ray (BD) 재생
44
오디오
7.1 CH HD 오디오 (Realtek ALC887 오디오 코덱 )
*7.1 CH HD 오디오를 구성하려면 HD 전면 패널 오디오 모듈
사용하고 다채널 오디오 기능을 오디오 드라이버로 활성
화해야 합니다 .
서지 보호 지원 (ASRock 스파이크 보호 )
ELNA 오디오
LAN
PCIE 1 , Gigabit LAN 10/100/1000 Mb/s
Realtek RTL8111E
Wake-On-LAN 지원
번개 /ESD 보호 지원 (ASRock 스파이크 보호 )
LAN 케이블 감지 지원
절전형 이더넷 802.3az 지원
PXE 지원
후면 패널
I/O
PS/2 마우스 / 키보드 포트 1
• D-Sub
포트 1
• DVI-D
포트 1
USB 2.0 포트 4 (ESD 보호 지원 (ASRock 스파이크
))
USB 3.0 포트 2 (ESD 보호 지원 (ASRock 스파이크
))
LED 장착 RJ-45 LAN 포트 1 (ACT/LINK LED SPEED
LED)
HD 오디오 : 라인 입력 / 전면 스피커 / 마이크
저장 장치
SATA3 6 Gb/s 커넥터 4 , NCQ, AHCI 플러그
커넥터
COM 포트 헤더 1
TPM 헤더 1
섀시 침입 스피커 헤더 1
CPU 커넥터 (4 ) 1 ( 스마트 속도 제어 )
섀시 커넥터 (4 ) 1 ( 스마트 속도 제어 )
24 ATX 전원 커넥터 1
4 12V 전원 커넥터 1
전면 패널 오디오 커넥터 1
45
H110M-DVS/D3
USB 2.0 헤더 1 (USB 2.0 포트 2 지원 )(ESD 보호 지원
(ASRock 스파이크 보호 ))
USB 3.0 헤더 1 (USB 3.0 포트 2 지원 )(ESD 보호 지원
(ASRock 스파이크 보호 ))
BIOS 기능
다국어 GUI 지원을 제공하는 128Mb AMI UEFI 적합형
BIOS
ACPI 1.1 준수 웨이크 이벤트
SMBIOS 2.3.1 지원
CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA 전압
조정
하드웨어
모니터
CPU/ 섀시 온도 감지
CPU/ 섀시 타코미터
CPU/ 섀시 저소음 (CPU 온도에 의한 섀시 속도 자동
조절 )
CPU/ 섀시 다중 속도 조절
케이스 열림 감지
전압 모니터링 : +12V, +5V, +3.3V, CPU Vcore, CPU
OS
Microso® Windows® 10 64 비트 / 8.1 64 비트 / 7 32 비트 / 7
64 비트
* Windows® 7 OS 설치하려면 , xHCI 드라이버를 ISO 파일
포함시킨 수정된 설치 디스크가 필요합니다 . 자세한 사용
법은 62 페이지를 참조하십시오 .
* 업데이트된 Windows® 10 드라이브에 대한 자세한 내용은
음의 ASRock 웹사이트를 참조하십시오 .
http://www.asrock.com
인증
FCC, CE, WHQL
ErP/EuP 사용 가능 (ErP/EuP 사용 가능 전원공급장치
)
* 자세한 제품 정보에 대해서는 당사 웹사이트를 참조하십시오 : http://www.asrock.com
46
BIOS 설정을 조정하거나 Untied Overclocking Technology 적용하거나 타업체의
버클로킹 도구를 사용하는 것을 포함하는 오버클로킹에는 어느 정도의 위험이 따른
다는 것을 유념하십시오 . 오버클로킹은 시스템 안정성에 영향을 주거나 심지어 시스
템의 구성 요소와 장치에 손상을 입힐 수도 있습니다 . 오버클로킹은 사용자 스스로
위험과 비용을 감수하고 해야 합니다 . 당사는 오버클로킹에 의해 발생할 있는
상에 대해서 책임이 없습니다 .
47
H110M-DVS/D3
日本語
仕様
プラットフォーム
ATX
PCB
CPU
6 Intel® Core
TM
i7/i5/i3/Pentium®/Celeron®
1151
Intel® 2.0
チップセット
Intel® H110
メモリ
DDR3/DDR3L
2 x DDR3/DDR3L DIMM
DDR3/DDR3L 1600/1333/1066 ECC
32GB
Intel® XMP 1.3/1.2
拡張スロット
1 x PCI Express 3.0 x16 PCIE1 x16
2 x PCI Express 2.0 x1
グラフィックス
* Intel®HD VGA
GPU
Intel®HD
AVC MVC (S3D) MPEG-2 HW 1
Intel® Quick Sync Video Intel® InTru
TM
3D Intel®
HD Intel®
TM
Intel® HD
510/530
Pixel Shader 5.0, DirectX 12
1792MB
:
DVI-D D-Sub
DVI-D 1920x1200 @60Hz
D-Sub 1920x1200 @60Hz
48
日本語
HDMI
12bpc xvYCC HBR
HDMI
: HEVC,
VP8, VP9
DVI-D HDCP
DVI-D Full HD 1080p Blu-ray (BD)
オーディオ
7.1 CH HD (Realtek ALC887 Audio Codec)
*7.1 CH HD HD
ASRock
ELNA
LAN
PCIE x1 LAN 10/100/1000 Mb/s
Realtek RTL8111E
/ ESD ASRock
LAN
802.3az
PXE
リアパネル I/O
1 x PS/2 /
1 x
D-Sub
1 x DVI-D
4 x USB 2.0 ESD ASRock
2 x USB 3.0 ESD ASRock
LED 1 x RJ-45 LAN ACT/LINK LED
SPEED LED
HD : /
/
49
H110M-DVS/D3
日本語
ストレージ
4 x SATA3 6.0 Gb/s NCQ AHCI
コネクタ
1 x COM
1 x TPM
1 x
1 x CPU 4
1 x 4
1 x 24 ATX
1 x 4 12V
1 x
1 x USB 2.0 2 USB 2.0
ESD ASRock
1 x USB 3.0 2 USB 3.0
ESD ASRock
BIOS 機能
128Mb AMI UEFI Legal BIOS GUI
ACPI 1.1
SMBIOS 2.3.1
CPU GT_CPU DRAM PCH 1.0V VCCIO VCCSA
ハードウェ
モニ
ター
CPU/
CPU /
CPU/ CPU
CPU/
: +12V +5V +3.3V CPU Vcore CPU
OS
Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* Windows® 7 OS xHCI
ISO
62
* Windows® 10 ASRock
: http://www.asrock.com
50
日本語
認証
FCC CE WHQL
ErP/EuP Ready ErP/EuP
BIOS
* http://www.asrock.com
51
H110M-DVS/D3
简体中文
简体中文
规格
平台
Micro ATX 规格尺寸
稳固的电容器设计
高密度防潮纤维电路板
CPU
支持第 6 Intel® Core
TM
i7/i5/i3/Pentium®/Celeron® 处理器
(Socket 1151)
支持 Intel® Turbo Boost 2.0 技术
芯片集
Intel® H110
内存
双通道 DDR3/DDR3L 内存技术
2 x DDR3/DDR3L DIMM
支持 DDR3/DDR3L 1600/1333/1066 ECC,非缓冲内存
支持系统内存最大容量: 32GB
支持 Intel® Extreme Memory Prole (XMP)1.3/1.2
扩充槽
1 x PCI Express 3.0 x16 插槽(PCIE1x16 模式 )
2 x PCI Express 2.0 x1 插槽
图形
* 只有 GPU 集成的处理器才支持 Intel® HD Graphics 内置视效
VGA 输出。
支持 Intel® HD Graphics 内置视效 : Intel® 快速同步视频,
采用 AVCMVC (S3D) MPEG-2 Full HW Encode1
Intel® InTru
TM
3DIntel® Clear Video HD 技术、Intel®
Insider
TM
Intel® HD Graphics 510/530
Pixel Shader 5.0DirectX 12
最大共享内存 1792MB
双图形输出 : 通过独立显示控制器支持 DVI-D D-Sub
端口
支持 DVI-D60Hz 时最大分辨率达 1920x1200
支持 D-Sub60Hz 时最大分辨率达 1920x1200
支持加速媒体编解码器: HEVC, VP8, VP9
通过 DVI-D 端口支持 HDCP
通过 DVI-D 端口支持全高清 1080p Blu-ray (BD) 播放
52
简体中文
简体中文
音频
7.1 CH 高清音频 (Realtek ALC887 音频编解码器 )
* 要配置 7.1 CH 高清音频,需要使用高清前面板模块和通过
音频驱动程序启用多通道音频功能。
支持电涌保护(华擎全防护)
ELNA 音频电容
LAN
PCIE x1 Gigabit LAN 10/100/1000 Mb/s
Realtek RTL8111E
支持 Wake-On-LAN(网上唤醒)
支持雷电 /ESD 保护(华擎全防护)
支持 LAN 线缆检测
支持高能效以太网 802.3az
支持 PXE
后面板 I/O
1 x PS/2 鼠标 / 键盘端口
1 x
D-Sub
端口
1 x DVI-D 端口
4 x USB 2.0 端口(支持 ESD 保护,即华擎全防护)
2 x USB 3.0 端口(支持 ESD 保护,即华擎全防护)
1 x RJ-45 LAN 端口,带 LEDACT/LINK LED SPEED
LED
高清音频插孔 : 线路输入 / 前扬声器 / 麦克风
存储
4 x SATA3 6.0 Gb/s 接口,支持 NCQAHCI 和热插拔
接口
1 x COM 端口接头
1 x TPM 接脚
1 x 机箱侵入和扬声器接脚
1 x CPU 风扇接口(4 针)(智能风扇速度控制)
1 x 机箱风扇接口(4 针)(智能风扇速度控制)
1 x 24 ATX 电源接口
1 x 4 12V 电源接口
1 x 前面板音频接口
1 x USB 2.0 接脚(支持 2 USB 2.0 端口,支持 ESD 保护,
即华擎全防护)
1 x USB 3.0 接脚(支持 2 USB 3.0 端口,支持 ESD 保护,
即华擎全防护)
53
H110M-DVS/D3
简体中文
简体中文
* 有关详细产品信息,请访问我们的网站:
http://www.asrock.com
BIOS 功能
特点
128Mb AMI UEFI Legal BIOS,支持多语言 GUI
ACPI 1.1 兼容唤醒事件
SMBIOS 2.3.1 支持
CPUGT_CPUDRAMPCH 1.0VVCCIOVCCSA
电压多次调整
硬件监控
CPU/ 机箱温度感测
CPU/ 机箱风扇转速计
CPU/ 机箱静音风扇(根据 CPU 温度自动调整机箱风扇
速度)
CPU/ 机箱风扇多种速度控制
CASE OPEN(机箱打开)检测
电压监控: +12V+5V+3.3VCPU VcoreCPU
操作系统
Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* 要安装 Windows® 7 OS,需要 xHCI 驱动程序已封装到 ISO
文件的经修改的安装盘。请参考第 62 页了解详情。
* 有关已更新的 Windows® 10 驱动程序,请访问华擎网站了
解详情 : http://www.asrock.com
认证
FCCCEWHQL
ErP/EuP 支持(需要支持 ErP/EuP 的电源)
须认识到超频会有一定风险,包括调整 BIOS 设置,应用自由超频技术,或使用
第三方超频工具。超频可能会影响到系统的稳定性,甚至对系统的组件和设备造成损
坏。执行这项工作您应自担风险和自己承担费用。我们对由于超频而造成的损坏概不
负责。
54
简体中文
简体中文
电子信息产品污染控制标示
依据中国发布的「电子信息产品污染控制管理办法」及 SJ/T 11364-2006「电子
信息产品污染控制标示要求」,电子信息产品应进行标示,藉以向消费者揭露
产品中含有的有毒有害物质或元素不致发生外泄或突变从而对环境造成污染或
对人身、财产造成严重损害的期限。依上述规定,您可于本产品之印刷电路板
上看见图一之标示。图一中之数字为产品之环保使用期限。由此可知此主板之
环保使用期限为 10 年。
图一
有毒有害物质或元素的名称及含量说明
若您欲了解此产品的有毒有害物质或元素的名称及含量说明,请参照以下表格
及说明。
有害物质或元素
(Pb) (Cd) (Hg) 六价铬 (Cr(VI)) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
印刷电路板
及电子组件
外部信号连
接头及线材
部件名称
X O O O O O
X O O O O O
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006 标准规定
的限量要求以下。
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准
规定的限量要求,然该部件仍符合欧盟指令 2002/95/EC 的规范。
备注 : 此产品所标示之环保使用年限,系指在一般正常使用状况下。
55
H110M-DVS/D3
繁體中文
規格
平台
Micro ATX 尺寸
固態電容設計
高密度防潮纖維電路板
CPU
支援第 6 Intel® Core
TM
i7/i5/i3/Pentium®/Celeron® 處理器
(插座 1151
支援 Intel® Turbo Boost 2.0 技術
晶片組
Intel® H110
記憶體
雙通道 DDR3/DDR3L 記憶體技術
2 x DDR3/DDR3L DIMM 插槽
支援 DDR3/DDR3L 1600/1333/1066 ECC、無緩衝記憶
最大系統記憶體容量:32GB
支援 Intel® Extreme Memory Prole (XMP)1.3/1.2
擴充插槽
1 x PCI Express 3.0 x16 插槽(PCIE1x16 模式 )
2 x PCI Express 2.0 x1 插槽
顯示卡
* 僅限整合 GPU 的處理器才可支援 Intel® HD Graphics Built-in
Visuals VGA 輸出。
支援 Intel® HD Graphics Built-in Visuals 轉換 AVC
MVC (S3D) MPEG-2 Full HW Encode1 Inte高速影
像同步轉檔技術、Intel® InTru
TM
3D, Intel® Clear Video HD
TechnologyIntel® Insider
TM
Intel® HD Graphics 510/530
Pixel Shader 5.0DirectX 12
最大共用記憶體 1792MB
雙圖形輸出: 透過獨立顯示控制器支援 DVI-DI D-Sub
連接埠
支援最高達 1920x1200 @ 60Hz 解析度的 DVI-D
支援最高達 1920x1200 @ 60Hz 解析度的 D-Sub
支援加速媒體轉碼器: HEVC, VP8, VP9
支援含 DVI-D 連接埠的 HDCP
支援透過 DVI-D 連接埠的 Full HD 1080p Blu-ray (BD)
56
繁體中文
音訊
7.1 CH HD 音訊 (Realtek ALC887 音訊轉碼器 )
* 若要設定 7.1 CH HD 音訊,必須使用 HD 前面板音訊模組,
並透過音訊驅動程式啟用多聲道音訊功能。
支援突波保護(華擎全防護)
ELNA 音響級電容
LAN
PCIE x1 Gigabit LAN 10/100/1000 Mb/s
Realtek RTL8111E
支援網路喚醒
支援雷擊/靜電保護(華擎全防護)
支援 LAN 纜線偵測
支援 Energy Ecient Ethernet 802.3az
支援 PXE
後面板 I/O
1 x PS/2 滑鼠/鍵盤連接埠
1 x D-Sub 連接埠
1 x DVI-D 連接埠
4 x USB 2.0 連接埠(支援靜電保護(華擎全防護))
2 x USB 3.0 連接埠(支援靜電保護(華擎全防護))
1 x RJ-45 LAN 連接埠,含 LEDACT/LINK LED
SPEED LED
HD 音訊插孔: 線路輸入/前置喇叭/麥克風
儲存裝置
4 x SATA3 6.0 Gb/s 接頭,支援 NCQAHCI 「熱插拔」
接頭
1 x COM 連接埠排針
1 x TPM 排針
1 x 機殼防護排針
1 x CPU 風扇接頭 (4-pin)(智慧型風扇速度控制)
1 x 機殼風扇接頭 (4-pin)(智慧型風扇速度控制)
1 x 24 pin ATX 電源接頭
1 x 4 pin 12V 電源接頭
1 x 前面板音訊接頭
1 x USB 2.0 排針(支援 2 USB 2.0 連接埠)(支援靜電保
護(華擎全防護))
1 x USB 3.0 排針(支援 2 USB 3.0 連接埠)(支援靜電保
護(華擎全防護))
57
H110M-DVS/D3
繁體中文
BIOS 功能
128Mb AMI UEFI Legal BIOS 含多語 GUI 支援
ACPI 1.1 符合喚醒自動開機
支援 SMBIOS 2.3.1
CPUGT_CPUDRAMPCH 1.0VVCCIOVCCSA
壓多重調整
硬體監視
CPU /機殼溫度感應
CPU /機殼風扇轉速計
CPU /機殼靜音風扇(依 CPU 溫度自動調整機殼風扇速度)
CPU /機殼風扇多重速度控制
機殼開啟偵測
電壓監控: +12V+5V+3.3VCPU VcoreCPU
作業系統
Microso® Windows® 10 64 位元/ 8.1 64 位元/ 7 32 位元/ 7
64 位元
* 若要安裝 Windows® 7 作業系統,需要使用修改過的安裝光碟
(已將 xHCI 驅動程式封裝至 ISO 檔案)。如需詳細說明,請
查看第 62 頁。
* 關於最新 Windows® 10 驅動程式的詳細資訊,請瀏覽華擎網
站:http://www.asrock.com
認證
FCCCEWHQL
ErP/EuP ready(須具備 ErP/EuP ready 電源供應器)
請務必理解,超頻可能產生某種程度的風險,其中包括調整 BIOS 中的設定、採用自
由超頻技術或使用協力廠商的超頻工具。超頻可能會影響您系統的穩定性,或者甚至
會對您系統的元件及裝置造成傷害。您應自行負擔超頻風險及成本。我們對於因超頻
所造成的可能損害概不負責。
* 如需產品詳細資訊,請上我們的網站:
http://www.asrock.com
58
Bahasa Indonesia
Spesikasi
Platform
• Bentuk dan Ukuran Micro ATX
• Desain Kapasitor Solid
• PCB Serat Kaca dengan Kerapatan Tinggi
CPU
• Mendukung Prosesor i7/i5/i3/Pentium®/Celeron® (Soket 1151)
Intel® Core
TM
Generasi ke-6
• Mendukung Teknologi Intel® Turbo Boost 2.0
Chipset
• Intel® H110
Memori
• Teknologi Memori DDR3/DDR3L Kanal Ganda
• 2 x Slot DDR3/DDR3L DIMM
• Mendukung DDR3/DDR3L 1600/1333/1066 non-ECC,
memori tanpa buer
• Kapasitas maksimum memori sistem: 32GB
• Mendukung Intel® Extreme Memory Prole (XMP)1.3/1.2
Slot Ek-
spansi
• 1 x Slot PCI Express 3.0 x16 (PCIE1:x16 mode)
• 2 x Slot PCI Express 2.0 x1
Gras
* Intel® HD Graphics Built-in Visuals dan output VGA hanya
dapat didukung dengan prosesor yang terintegrasi GPU.
• Mendukung Intel® HD Graphics Built-in Visuals: Intel® Quick
Sync Video dengan AVC, MVC (S3D), dan MPEG-2 Full HW
Encode1, Intel® InTru
TM
3D, Teknologi Intel® Clear Video HD,
Intel® Insider
TM
, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Memori bersama maksimum 1792MB
• Output gras ganda: Mendukung port DVI-D dan D-Sub
dengan kontrol layar independen
• Mendukung DVI-D dengan resolusi maksimum hingga
1920x1200 @ 60Hz
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H110M-DVS/D3
Bahasa Indonesia
• Mendukung D-Sub dengan resolusi maksimum hingga
1920x1200 @ 60Hz
• Mendukung Codec Media Terakselerasi HEVC, VP8, VP9
• Mendukung HDCP dengan port DVI-D
• Mendukung pemutaran 1080p Blu-ray HD Penuh (BD)
dengan Port DVI-D
Audio
• Audio HD 7.1 CH (Realtek ALC887 Audio Codec)
*Untuk mengkongurasi Audio HD 7.1 CH, modul audio panel
depan HD harus digunakan dan tur audio multisaluran harus
diaktian melalui driver audio.
• Mendukung Perlindungan Lonjakan Arus (ASRock Full Spike
Protection)
• ELNA Audio Caps
LAN
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111E
• Mendukung Wake-On-LAN
• Mendukung Perlindungan Petir/ESD (ASRock Full Spike
Protection)
• Mendukung Deteksi Kabel LAN
• Mendukung Energy Ecient Ethernet 802.3az
• Mendukung PXE
Panel I/O
Belakang
• 1 x Port Mouse/Keyboard PS/2
• 1 x Port D-Sub
• 1 x Port DVI-D
• 4 x Port USB 2.0 (Mendukung Perlindungan ESD (ASRock
Full Spike Protection))
• 2 x Port USB 3.0 (Mendukung Perlindungan ESD (ASRock
Full Spike Protection))
• 1 x Port LAN RJ-45 dengan LED (ACT/LINK LED dan
SPEED LED)
• Soket Audio HD: Saluran Masuk/Speaker Depan/Mikrofon
60
Bahasa Indonesia
Penyim-
panan
• 4 x Konektor SATA3 6,0 Gb/s, mendukung NCQ, AHCI, dan
Hot Plug
Konektor
• 1 x Header Port COM
• 1 x Header TPM
• 1 x Intrusi Chassis dan Header Speaker
• 1 x Konektor Kipas CPU (4-pin) (Kontrol Kecepatan Kipas
Pintar)
• 1 x Konektor Kipas Chassis (4-pin) (Kontrol Kecepatan Kipas
Pintar)
• 1 x Konektor Daya ATX 24 pin
• 1 x Konektor Daya 4 pin 12V
• 1 x Konektor Audio Panel Depan
• 1 x Header USB 2.0 (Mendukung 2 port USB 2.0) (Mendukung
Perlindungan ESD (ASRock Full Spike Protection))
• 1 x Header USB 3.0 (Mendukung 2 port USB 3.0) (Mendukung
Perlindungan ESD (ASRock Full Spike Protection))
Fitur BIOS
• 128Mb AMI UEFI Legal BIOS dengan dukungan GUI multi-
bahasa
• ACPI 1.1 Kompatibel dengan aktivitas pengaktifan
• Dukugan SMBIOS 2.3.1
• Multipengatur Tegangan CPU, GT_CPU, DRAM, PCH 1,0V,
VCCIO, dan VCCSA
Monitor
Perangkat
Keras
• Sensor suhu CPU/Chassis
• Takometer Kipas CPU/Chassis
• Kipas Hening CPU/Chassis (Penyesuaian otomatis kecepatan
kipas berdasarkan suhu CPU)
• Kontrol multikecepatan Kipas CPU/Chassis
• Deteksi CASE OPEN
• Pemantauan tegangan: +12V, +5V, +3,3V, CPU Vcore, CPU
OS
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit
* Untuk menginstal OS Windows® 7, diperlukan disk instalan
termodikasi dengan driver xHCI dalam le ISO. Untuk petunjuk
lebih rinci, lihat halaman 62.
* Untuk driver Windows® 10 terbaru, kunjungi situs web ASRock
untuk informasi lebih lanjut: http://www.asrock.com
61
H110M-DVS/D3
Bahasa Indonesia
Sertikasi
• FCC, CE, WHQL
• Siap untuk ErP/EuP (memerlukan catu daya untuk ErP/EuP)
Perlu diketahui, overclocking memiliki risiko tertentu, termasuk menyesuaikan pengaturan
pada BIOS, menerapkan Teknologi Untied Overclocking, atau menggunakan alat overclocking
pihak ketiga. Overclocking dapat mempengaruhi stabilitas sistem, atau bahkan dapat men-
gakibatkan kerusakan komponen dan perangkat sistem. Risiko dan biaya apapun menjadi
tanggungan Anda. Kami tidak bertanggung jawab atas kemungkinan kerusakan karena
overclocking.
* Untuk informasi tentang produk rinci, kunjungi situs web kami: http://www.asrock.com
62
English
Enabling USB Ports for Windows® 7 Installation
Intel® Braswell and Skylake has removed their support for the Enhanced Host
Controller Interface (EHCI – USB2.0) and only kept the eXtensible Host Controller
Interface (XHCI – USB3.0). Due to that fact that XHCI is not included in the
Windows 7 inbox drivers, users may nd it dicult to install Windows 7 operating
system because the USB ports on their motherboard won’t work. In order for the
USB ports to function properly, please create a Windows® 7 installation disk with
the Intel® USB 3.0 eXtensible Host Controller (xHCI) drivers packed into the ISO
le.
Requirements
• A Windows® 7 installation disk or USB drive
• USB 3.0 drivers (included in the ASRock Support CD or website)
• A Windows® PC
• Win7 USB Patcher (included in the ASRock Support CD or website)
Scenarios
You have an ODD and PS/2 ports:
If there is an optical disc drive, PS/2 ports and PS/2 Keyboard or mouse on your computer,
you can skip the instructions below and go ahead to install Windows® 7 OS.
You only have an ODD (For Intel Skylake platforms only):
If there is an optical disc drive but no PS/2 ports on your computer, please enable the “PS/2
Simulator” option in UEFI SETUP UTILITY > Advanced > USB Congu ration, which
allows the USB port to function as a PS/2 port, and then you can install the Windows® 7
OS. Please set PS/S Simulator back to disabled aer the installation.
You’ve got nothing:
If you do not have an optical disc drive, please nd another computer and follow the
instructions below to create a new ISO le with the “Win7 USB Patcher”. en use the new
patched Windows® 7 installation USB drive to install Windows® 7 OS.
63
English
H110M-DVS/D3
Instructions
Step 1
Insert the Windows® 7 installation disk or USB drive to your system.
Step 2
Extract the tool (Win7 USB Patcher) and launch it.
Step 3
Select the “Win7 Folder” from Step1 by clicking the red circle as shown as the picture
below.
Step 4
Select the “USB Driver Folder” by clicking the red circle as shown as the picture below.
If you are using ASRocks Support CD for the USB 3.0 driver, please select your CD-ROM.
64
English
Step 5
Select where to save the ISO le by pressing the red circle as shown as the picture below.
Step 6
If you want to burn the patched image to a CD, please check “Burn Image” and select “Target
Device to Burn”. If not, the patched ISO image will be exported to the destination selected
in Step5. en Press “Start” to proceed.
Step 7
Now you are able to install Windows® 7 on Braswell or Skylake with the new burned CD.
Or please use the patched ISO image to make an OS USB drive to install the OS.
Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRocks website at http://www.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at http://www.asrock.com/support/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
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ASROCK H110M-DVS/D3 Manual de usuario

Tipo
Manual de usuario